Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Tue Aug 31 19:17:43 EDT 2004 | russ
Now see Dave, now I have some good info on why it is "bad", This must be the lead enrichment I have heard about but never got any substantiated data or explanantion. I wonder how much weaker or less reliable these are. Is there any data that you k
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Thu May 06 06:47:12 EDT 2004 | praveen
Hi, I just need to undestand any issue? If I mount Pb free BGA and use normal SN/Pb solder paste?
Electronics Forum | Wed Jun 02 19:01:50 EDT 2004 | lynnmc
Thanks to all on this feedback
Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
