Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas
It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??
Electronics Forum | Mon Jul 14 20:49:22 EDT 2003 | Thomas
Hi Need some help here. Anybody got the recommended profile for Sn50/Pb50 solder paste. Thanks.
Electronics Forum | Tue Jul 15 10:33:39 EDT 2003 | MA/NY DDave
Hi, What are you soldering with Pb50Sn50? YiEngr, MA/NY DDave
Electronics Forum | Tue Jan 23 16:28:14 EST 2007 | Jim
If by any chance you happen to find one, please let me know.
Electronics Forum | Tue Jan 23 16:53:45 EST 2007 | patrickbruneel
Can not be done without drastic alterations to the laws of physics Patrick
Electronics Forum | Tue Jan 23 19:27:28 EST 2007 | asir
which characteristics? An alloy with similar melting points, wetting, shear force, reliabilities, etc. Indium has an article about 77.2Sn/20.0In/2.8Ag, but was wondering is there any other out there.
Electronics Forum | Tue Jul 15 21:05:55 EDT 2003 | Thomas
Hi Dave, I saw many of your outstanding comments and postings. Can you save me this time on the profile recommendation ??
Electronics Forum | Wed Jul 16 11:54:25 EDT 2003 | MA/NY DDave
Hi, I agree with everyone else talk to the Mfg and ask for their recommended profiles. They should know the heating and the cooling profiles. If you really want to do this yourself you are going to have to run several experiments to determine just
Electronics Forum | Tue Jan 23 17:16:07 EST 2007 | darby
Check out the web sites of the major solder manufacturers. From a quick glance most of the pastes around that temperature range have problems with Zn content and may not be available as pastes???? Depending on your application, some of the lower melt
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.