Electronics Forum: pcb and grain and direction (Page 2 of 3)

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

silicone conformal coat and electrical contacts

Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw

I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a

First time Pick and Place Machine

Electronics Forum | Tue Jul 18 03:11:48 EDT 2017 | tsvetan

I recently bought: PCB Loader, Full Automatic Printer with vision with 10 seconds print time, 1 meter Inspection Conveyor, Samsung SM482+Feeders, 1 meter Inspection conveyor, Reflow oven for similar budged, all machines new. I bought them directl

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon

As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin

Re: Bow and Twist of PCB's

Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon

| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde

Yestech B3 Capacitors and P+P downtime

Electronics Forum | Tue Apr 05 10:36:24 EDT 2011 | frcdave

Hi Don, The YESTech B3 can be used post placement very easily. I would suggest contacting their service team, they could walk you through the process quickly. You are actually very close to being able use it now in that capacity since you have the i

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

ECN, ECO and Board Mods for Unpopulated Boards

Electronics Forum | Wed Dec 25 02:38:32 EST 2013 | alexeis

Hi, If you are on SMT process, you may check our product, called QPlace UPD, for updating ECN/ECO and Board Modes directly on previous/different version of PCB including delta list of all differents that can be used on next production steps. Feel f


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