Electronics Forum | Wed Feb 25 09:40:31 EST 1998 | Doug Romm
Steve, TI does not produce any SOTs using Palladium finish leadframes. I would certainly be interested to know who is. Also, your observations are correct: In TI experience the mechanical strength of the solder joints with Pd finish ICs is alw
Electronics Forum | Tue Jun 03 18:34:22 EDT 2003 | Kris
Hi, There have been other studies where it was found that lead-free soloder joints are more reliable than tin-lead solder joints irrespective of test conditions. In fact the automotive industry has been using Sn/Ag for underhood applications for a
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Electronics Forum | Thu Jun 05 16:44:19 EDT 2003 | blnorman
The data we have is from an IBM report. Below 100�C the SAC reliability is almost double that of SnPb (-40 to 100�C thermal cycle). When the upper end temp is increased to 125�C the reliability drops to 75% of SnPb. I'd like to see the data that s
Electronics Forum | Fri Oct 01 02:46:47 EDT 2021 | sn
Thanks, Evtimov. In terms of mechanical drop performance, can we conclude that the higher Ag alloy will have poorer drop shock performance relatively compare to those with lower Ag? The Ag3Sn is a good IMC for welding strength?
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Fri Oct 01 01:25:55 EDT 2021 | sn
Thank you Djo for your sharing. By the way, do you know that which field/product will prefer to use SAC405 paste instead of SAC305 or lower Ag wt% alloy solder paste?
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Thu Sep 23 08:08:12 EDT 2021 | SN
Hi. Anyone in this forum experienced the lead-free solder paste SAC305 and SAC405? What are the differences to expect for solder paste with SAC305 and SAC405? What is the effect of silver (Ag) alloy in solder paste? It was really appreciated if could
