Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Fri Dec 16 10:25:14 EST 2005 | GS
Hi Liza - polystirene monolayer (blend ?) could be sealed at less presure, ie 35-40 PSI. Temprature could be 165�-170�C. For sure after sealed you shoud make sure the sealing strength (peel strength)should meet min 15-25 N.(bet avg from 25 to 45 N)
Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick
Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Fri Jul 04 09:01:49 EDT 2003 | davef
You should see a coarse silverish / grayish coat on the termination that indicates that it soldered. We have to opinion [don't know] about the strength of solder connection versus the strength of component terminations.
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Thu May 27 07:04:42 EDT 2010 | dervinsanjose
Anybody who could help me what is the tape peel off speed of PANASONIC CM602 for 8mm feeder? Appreciate your feedback.
