Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Wed May 07 15:26:05 EDT 2008 | joeherz
Interesting - We're using the same AIM products as you. On the lead free, 353, did you start out with it or did you try the WS485? That was the 1st product recommendation we got from AIM and we found that the lot to lot consistency was not good. T
Electronics Forum | Sun Aug 03 09:44:10 EDT 2014 | isd_jwendell
I have 2 experiences with Manncorp machines and support, both were not good. Example: One manual was written in Japanese. I requested an English version, but was told it doesn't exist so too bad. I had to pay a local translator to get what Manncorp
Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F
| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Aug 28 12:05:12 EDT 2015 | davef
“The global automotive industry demands world class levels of product quality, productivity and competitiveness as well as continual improvement. To achieve this goal many vehicle manufacturers insist that suppliers are certified to the quality manag
Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef
Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
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