Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms
Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Mon Mar 07 08:22:09 EST 2005 | davef
Via in pad can have any size hole, but you're correct. The larger the hole, the more solder that is scavenged from the solder connection. We believe that a proper via in pad design will either: * Move the via to the edge of the pad and cover the vi
Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe
We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening
Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D
one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response
Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek
Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.