Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef
Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui
Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks
Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits