Electronics Forum | Thu Sep 25 13:53:56 EDT 2003 | russ
There isn't any difference in the printing process regarding leadfree vs. lead. The only differences are in the reflow process. Russ
Electronics Forum | Wed Nov 05 18:24:11 EST 2014 | wbrenner
Thanks for the contact info . I have the DEK process eng coming in.
Electronics Forum | Tue Aug 24 10:36:20 EDT 1999 | Chad Barnett
JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH.
Electronics Forum | Mon Mar 14 18:20:50 EST 2005 | yoman
I'm trying to develop an spc chart for the stencil printing process but don't know which direction to go. Any suggestion?
Electronics Forum | Mon Oct 30 04:43:41 EST 2000 | G. English
I have just recently finished 'experimenting' (perfecting ,if my boss reads this), with this process, and can finally say I have cracked it! There are many pitfalls (some of which I am still hurting from), send me an e.mail and I shall elaborate furt
Electronics Forum | Wed Mar 27 12:37:12 EST 2002 | jax
Barry, If you are looking to set up a documented process with set parameters you might think about performing a DOE based on the parameters you can control or change. With any measurement device you should be able to log the info gathered so you ca
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Tue Oct 13 18:03:40 EDT 1998 | Sanjay Bhatikar
Sirs, What are the issues involved when a stencil printer is used for printing solder paste and adhesive? UV-curing of adhesive appears to help reduce slump and spread by forming a tough skin on the adhesive blob deposited on the PCB. Is th
Electronics Forum | Mon Mar 14 18:32:46 EST 2005 | russ
what did your D.O.E. studies show you as the critical parameters? These are the ones that you need to measure. If you did not perform DOE than you probably should prior to putting an SPC chart out there. What type of measurement capabilities regar
Electronics Forum | Mon Mar 07 06:44:39 EST 2022 | SMTA-64386201
We previously labelled PCBs after assembly but before AOI. Now we need to trace panels during assembly as well, so have the need to apply labels before the assembly process starts. Our stencils are thus not stepped to accommodate labels. I suppose t
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