Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT
We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef
If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that
Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf
I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom
Electronics Forum | Thu Sep 10 19:26:24 EDT 2020 | emeto
Are parts always following the same side/direction of tombstone? 1. Run 180 and observe if tombstone moves or remains the same 2. Too much paste under the part - reduce aperture and move it out to the lead. 3. Soak profile for even heat distribution
Electronics Forum | Wed May 10 01:17:47 EDT 2000 | Edmund S. Molina
How to avoid tombstoning of film capacitors. The temperature profile is within standard/specifications, printing is good and placement is okay but tombstoning of film capacitor still occur. I need your help. Thank you.
Electronics Forum | Mon Apr 01 10:24:29 EDT 2013 | emeto
First check the profile. I would go with linear profile and smoother increase of temperature. Usually you will get tombstones when you have too aggressive profile. My next step will be to redesign the stencil.
Electronics Forum | Tue May 09 18:30:35 EDT 2006 | muse95
I can understand the theory behind fewer tombstones with SAC. If people were having tombstone problems with SnPb eutectic solder, often switching to Sn62Pb36Ag2 would improve it, because with the addition of some silver, a small plastic zone in the
Electronics Forum | Fri Mar 28 22:01:00 EST 2003 | MA/NY DDave
Hi Yes I agree, yet this subject is about Tombstoning and oven profile or even oven working correctly across the entire product is a sub-set of how one gets those little chip babies to sit and stay where they belong. Flat and Heeling like their mast
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
