Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Wed May 23 10:11:43 EDT 2012 | blnorman
Simple answer is no, there is no universally acknowledged acceptance criteria. Some time ago, I started a spreadsheet with the acceptance levels suggested by various labs on the individual ionic species. All are relatively close in their individual
Electronics Forum | Tue Sep 26 10:04:52 EDT 2000 | Chris May
Darren, You may/will get people referring you to the archives, which is a fair shout. But, by "failure rate" you probably mean "acceptance". What is good and bad depends upon your own acceptance criteria (IPC-610 ?). Find out what the acceptance c
Electronics Forum | Wed Nov 03 09:07:07 EST 2004 | dramos1
Hi, We would like to know on the IPC-A-610 rev. C standard for acceptable and reject criteria, do we have to satisfy all that are listed on the manual or either one will be OK? Thanks for all the assistance that will provided. Dennis1
Electronics Forum | Thu Oct 27 09:16:37 EDT 2005 | Jay
We are currently in the process of purchasing new SMT placement equipment. Any suggestions for factory acceptance criteria?
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Tue May 22 19:28:31 EDT 2012 | Rick Thompson
Are there any established acceptance criteria for contaminants based on Ion Chromatography testing? I've found some references to certain levels for some contaminants but there doesn't seem to be any industry consensus. Any feedback or reference to l
Electronics Forum | Thu Oct 27 11:07:17 EDT 2005 | moonshine
Go to http://www.moonmanondarkside.com for all the answers in the book and free downloads. MoonMan
