Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Wed Mar 31 20:34:03 EST 2004 | davef
We have not used this specific package. We agree on your toe fillet idea. Toe fillets add no strength to solder connections. This part is a MicroLeadFrame�, which is similar to QFN, BCC, LGA, and whatnot. Consider: * Searching the fine SMTnet Arch
Electronics Forum | Fri Jun 20 18:32:55 EDT 2008 | hegemon
Back when I used to do a lot of these style devices we ran into the same problem you are describing. Use a pattern for the center pad area and keep the total coverage to about 68% of the pad area. Diagonal Stripes, tic tac toe, cloverleaf, dot array
Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.
We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or
