Electronics Forum: reballing and problem (Page 2 of 65)

samsung cp40 help for problem with fiducial camera and fixing camera

Electronics Forum | Wed Jul 29 10:27:01 EDT 2015 | risorse_new

Goodmornin I have a problem with the fixing and move cameras, i don't see the image of the cameras on the screen. On the monitor i see the cross and letter, but i can no see on the black box the camera images. I know the problem is on the ADDA Board.

samsung cp40 help for problem with fiducial camera and fixing camera

Electronics Forum | Thu Aug 27 09:04:54 EDT 2015 | fcmtechnician

HI are the LED from Ilumination on?

Who knows SM411 MMI problem (Initializing machine I/F) and How to troubleshoot?

Electronics Forum | Thu May 12 01:20:48 EDT 2016 | darby

Check your interface boards and connections. Should be in your manual under "control rack/ board connection/ " then they have the various I/F boards. I don't know the initialisation sequence, but a PC whiz or Samsung should be able to tell you the or

Who knows SM411 MMI problem (Initializing machine I/F) and How to troubleshoot?

Electronics Forum | Thu May 12 02:17:58 EDT 2016 | cspasol

Thanks Mr. Darby, We already Check All connections of I/F Boards, Restore OS, Change Motherboards and Install Backup for SmartSM files and Install new MMI (SmartSM files). But still same Problem. I have one possible cause in my mind is its MVME3100

samsung cp40 help for problem with fiducial camera and fixing camera

Electronics Forum | Thu Jul 30 07:25:09 EDT 2015 | buckcho

Hello, I haven't worked with such machine, but do you have a led lighting, like in cp45, which is newer? Maybe there is something wrong with it and it is not lighting up?

BGA rework and reliability

Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

solderability and hasl thickness

Electronics Forum | Wed Sep 10 09:32:56 EDT 2003 | swagner

Dave F, so what kind of problems would I see if this turned into a problem?

Dye and Pry

Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks

Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa

SPC and Wave

Electronics Forum | Thu Jul 14 10:00:21 EDT 2005 | chunks

Any one using SPC to monitor their wave solder process? My point is collecting defects and using a scatter plot is useful but only after a problem occurs. SPC's true function is to warn of impending problems that are about to occur. Can SPC really


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