Electronics Forum | Mon Mar 16 11:40:56 EDT 2015 | swag
If it took you a long time to get it through pick and place or you had to do a lot of hand add of SMT parts, your paste can start to dry out especially on the small deposits. We've seen this time and time again. We've gotten way better at quickly p
Electronics Forum | Tue Aug 23 14:25:50 EDT 2005 | pjc
Here's the oil: BIO 30 - Biral Industrial oil (operates to +300�C ) BIO 30 is an extremely high quality synthetic industrial oil for a wide number of applications. BIO 30 leaves no carbon deposits and is highly resistant to oxidation. An outstandin
Electronics Forum | Mon Mar 16 13:35:20 EDT 2015 | swiese242
This has been a challenge for most manufacturers. It depends on board thickness, lead or lead free paste/parts. We have a slim-kic to get the profiles correct in our 14 zone oven. I believe it may be the recently posted suggestion of too much heat in
Electronics Forum | Tue Apr 14 20:28:03 EDT 2015 | carlosdugay123
Hello Marshall, I represent Metal Etch Services, we manufacture SMT Single and Multi-Level Stencils, we have over 25 years experience and one of the reasons most of our customers like us is because we offer technical assistance. Regarding the issue y
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders
my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Fri Sep 22 15:12:36 EDT 2000 | John Thorup
Hello Jon (?) Sounds like it's just plain too hot. The Panasonic VA series specifies a maximum preheat temp of 160C for
Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics
Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen
