Electronics Forum | Tue Jul 23 18:54:16 EDT 2002 | carln
Is anybody "successfully" cleaning adhesives from the DEK Pump Print stencils? Yes, Dave, I have searched the archives only to find comments ranging from easy to very difficult to clean. However, nobody states what process they are using. What ch
Electronics Forum | Mon Sep 21 18:37:10 EDT 2009 | sbayeta
Hi, Our SMT line has placement capacity of 80K cph, but only 21K cph gluing capacity. The rate between reflow and glue of our products is around 5 to 1. The line works great for the reflow boards, but when we produce glue boards the glue dispenser
Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Fri Oct 22 07:35:02 EDT 2004 | davef
Most glue suppliers recommend chemicals and methods for removing the product from stencils. What does yours suggest? Further, search the fine SMTnet Archives for background discussion.
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Mon Jul 29 15:24:07 EDT 2002 | OhioD
Interesting. From the reaction we got from DEK, I thought we were the only ones with pumpprint woes. We've tried 1 stencil with Bioact SC10, Hydrex SP&WS, Axarel, and Loctite remover on both Heraeus and Loctite glues. Some we spray, some we work-in m
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
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