Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Mon Jul 22 09:53:13 EDT 2019 | kylehunter
Hey all! As background, I recently purchased a full SMT line for my company. We have a DEK 265, an assembleon opal xii, and a Heller 1500. Currently our jobs are leaded, and the heller is working perfectly. An upcoming job that we are potentially g
Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan
thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod
Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef
You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we
Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef
I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
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