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Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Electronics Manufacturers to Gather in Shenzhen With Numerous Exhibits Targeted at the Industry Hotspots

Industry News | 2012-08-15 12:25:12.0

NEPCON South China 2012 will take place between August 28 and August 30, 2012 at the Shenzhen Convention & Exhibition Center

Reed Exhibitions

Electronics Manufacturers to Gather in Shenzhen With Numerous Exhibits Targeted at the Industry Hotspots

Industry News | 2012-08-20 07:56:16.0

NEPCON South China 2012will be present with their new products, providing a comprehensive showing of the latest electronics production equipment products and technologies.

Reed Exhibitions

JUKI RX-8 Pick and Place Machine

JUKI RX-8 Pick and Place Machine

New Equipment | Pick & Place

JUKI RX-8 Pick and Place Machine ​ JUKI RX-8 Pick and Place Machine Max PCB: 510mm×450mm Placing Speed:100,000CPH Weight: Around 1,810kg Dimension:998mm×1,895mm×1,530mm Product description: JUKI RX-8 Pick and Place Machine, Max PCB: 510mm×45

Flason Electronic Co.,limited

Online Dual head Selective Wave Soldering Machine

Online Dual head Selective Wave Soldering Machine

New Equipment | Wave Soldering

Online Dual head Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: Online Dual head Selective Wave Soldering Machine, max solder t

Flasonsmt Co.,ltd

ERSA POWERFLOW N2 Wave Soldeirng Machine

ERSA POWERFLOW N2 Wave Soldeirng Machine

New Equipment | Wave Soldering

ERSA POWERFLOW N2 Wave Soldeirng Machine Nitrogen Soldering Process PCB width: 508 mm preheat length of 3.2 m solder content: 525 to 725 kg 525 to 725 kg Product description: ERSA POWERFLOW N2 Wave Soldeirng Machine  INQUIRY ERSA P

Flasonsmt Co.,ltd

Automatic Selective Soldering Machine

Automatic Selective Soldering Machine

New Equipment | Wave Soldering

Automatic Selective Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm weight 380KG Product description: Automatic Selective Soldering Machine, max solder temperature 350℃, solder pot

Flasonsmt Co.,ltd

Selective Wave Soldering Machine Manufacturer

Selective Wave Soldering Machine Manufacturer

New Equipment |  

Selective Wave Soldering Machine Manufacturer max solder temperature 350℃ solder pot capacity 15 KG weight 380KG dimension L1280mm X W1400mm X H1650mm Product description: Selective Wave Soldering Machine Manufacturer, max solder temperature

Flasonsmt Co.,ltd

ERSA POWERFLOW PRO Wave Soldering Machine

ERSA POWERFLOW PRO Wave Soldering Machine

New Equipment | Wave Soldering

ERSA POWERFLOW PRO Wave Soldering Machine ERSA POWERFLOW PRO Nitrogen Wave Soldering Machine ERSA POWERFLOW PRO ERSA POWERFLOW PRO Wave Soldering Machine Wave Soldering Machine Product description: ERSA POWERFLOW PRO Wave Soldering Machine

Flasonsmt Co.,ltd

Integrated Selective Wave Soldering Machine

Integrated Selective Wave Soldering Machine

New Equipment | Wave Soldering

Integrated Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: Integrated Selective Wave Soldering Machine,max solder temperature 35

Flasonsmt Co.,ltd


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