Electronics Forum | Wed Jan 12 16:53:06 EST 2000 | Jason Webbs
Jacob, There are several companies I saw at a recent trade show that had "nibblers" that snap the tabs out. They are also called "board shockers" because they really shock the boards when they snap out the tabs. I did talk to a guy from a company
Electronics Forum | Sat Jan 03 18:13:58 EST 1998 | David Jacks
Tom: You are right. Pre-heating is just as necessary in rework as it is in intiial production. Zephyrtronics produces an economical convective bottom side pre-heater known as an airbath. This product ramps the substrate and assembly at 2-4 degrees
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Tue Oct 12 08:12:20 EDT 1999 | robert parker
any advice on smt resistors and capacitor that can survive an explosive shock. the ceramic smts are not, plastic ic's and discretes do fine.
Electronics Forum | Wed Sep 12 21:13:17 EDT 2001 | davef
Just because I�m not currently ranting about nuking Kabul, Tehran, Baghdad, and Algiers or laying a coat of jellied gasoline on those little punks celebrating with their candy in Palistine; that doesn�t mean my shock and grief will not turn to anger.
Electronics Forum | Wed Jan 08 03:27:18 EST 2003 | MA/NY DDave
Hi Another add, This depends on your application environment. If you have levels of shock and vibration or high thermals underfill is needed. YiE, MA/NY DDave
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Wed Jan 05 18:34:06 EST 2005 | russ
From what I have read so far the temps are, if not close to being the same for both alloy formulas. Preheat is a function of flux activation and thermal shock. Solder temp varies from place to place. Russ
