Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval
The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt
You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl
Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem
Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F
| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a
Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F
| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt
