Electronics Forum | Fri Feb 13 09:17:11 EST 2004 | Kris
we are worried about the coating not being able to cover underneath the BGA. If the coat is excessive then it would cause CTE issues. Also if anybody has data on 85/85, 1000 hrs after conformal coating of BGA, would appreciate if you guys can share
Electronics Forum | Wed Apr 28 09:37:54 EDT 1999 | Justin Medernach
| We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | We are considering trying boards with White Tin solderable surface
Electronics Forum | Thu Jan 30 15:41:52 EST 2003 | MikeF
The easy part is to determine which parts should be coated. The harder part is making sure the parts that should not be coated do not get coated. I don't even want to think about the amount of labor and materials I've lost due to conformal coat get
Electronics Forum | Thu Apr 13 07:18:47 EDT 2006 | Charles
It will be hard to solder metal that finish by any coating. So you should remove the coating first. You need strong acid to remove coating. After you solder both then you can silder finish esay.
Electronics Forum | Thu Apr 10 11:26:10 EDT 2003 | Lake
Does anyone have any experience with parylene coated BGA's. Can they be masked so parylene doesn't get underneath? How do you remove and replace? Is machining them off the only viable option? If so are there any special requirements /special fixturin
Electronics Forum | Thu Apr 10 11:26:18 EDT 2003 | Lake
Does anyone have any experience with parylene coated BGA's. Can they be masked so parylene doesn't get underneath? How do you remove and replace? Is machining them off the only viable option? If so are there any special requirements /special fixturin
Electronics Forum | Thu Feb 12 16:57:52 EST 2004 | blnorman
Why can't you conformally coat the BGA? We do on some of our lines with no adverse affects.
Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn
hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee
Electronics Forum | Mon Jun 24 22:39:25 EDT 2019 | sssamw
yes, the void should not expose the conductor or bridge the conductor, the coating there should be thick as IPC required but you need minimize the voids and bubbles. ALso for those small chips, a void or bubble on it means possible ECM, normlly shou
Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko
| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable