Electronics Forum | Tue Mar 04 17:27:07 EST 2003 | msivigny
Hello Dave, I can understand why you might not use the auto-correct function based on the time it takes to perform the operation. I question why there is an auto-correct function in the first place? If I understand the way this works correctly, the m
Electronics Forum | Fri Jul 07 03:27:31 EDT 2006 | dougs
Hi folks, thanks for all the tips. We have run our first batch of these flexi boards now. I had the PCB suppliers make me some 1.6mm FR4 carriers to lay the boards on to carry them through the process. (1 flat & 1 with cutouts for the second side)
Electronics Forum | Thu Feb 10 20:52:57 EST 2022 | compit
I have Emerald-X with Double Shuttle Tray Feeder. Can it be connected (DSTF, probably PA 2699/22) to the MG-1?
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Wed Apr 15 18:37:15 EDT 2020 | unisoft
The point here is if you can't get the full CAD files or the XY rotation files and all you get his Gerbers and a BOM. Most all contract manufacturers and some OEM's at some time or another have to deal with Gerber only files. If you find yourself i
Electronics Forum | Mon Sep 12 09:26:00 EDT 2016 | awhite
Our MPM Up2000 HIE is having a communication problem with any upstream machine we place in front of it...i.e. conveyor, board loader, etc. It all started when we removed a conveyor from inbetween it and a board loader, and hooked those machines up di
