Electronics Forum | Wed Jul 06 20:05:02 EDT 2011 | rickysanchez
we are using the silicone Dow Corning JCR6101UP. we use it to coat the whole die including the wires.
Electronics Forum | Mon Jul 11 11:40:11 EDT 2011 | blnorman
According to the datasheet, this is a LED encapsulant, is that how you are using it? It also had a section on compatibility, which indicates that it is an addition-cure silicone prone to cure inhibition.
Electronics Forum | Fri Jan 26 13:26:30 EST 2007 | rw
We are developing a new product that requires conformal coating on the motor controller. We selected a silicone based conformal coat due to its ease of use. There has been disagreement among engineers as to its impact on the motor. We have contact
Electronics Forum | Thu Feb 01 09:46:54 EST 2007 | blnorman
Especially VCM - volatile condensable materials. Strictly verboten around optics.
Electronics Forum | Thu Jul 07 10:07:40 EDT 2011 | duso02
Interesting stuff. I must admit that I am unfamiliar with that product but we use quite a bit of Dow and they are overall excellent silicone coatings. We do nothing but conformal coating here and bubbles are usually from curing to quickly. Without kn
Electronics Forum | Fri Feb 02 08:36:14 EST 2007 | CK Flip
Wow, I cut first cut my teeth in the Industrial motor control industry. My 1st company made motor control products like variable speed drives, solid state overload relays, soft starts, etc. and in our shop, we used nothing BUT Dow Corning silicone p
Electronics Forum | Thu Feb 01 08:47:07 EST 2007 | davef
NASA is concerned about outgassing in high-vacuum environments. They select materials to minimize outgassing. http://outgassing.nasa.gov/og_desc.html
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
Electronics Forum | Tue Jul 05 17:43:43 EDT 2011 | davef
We agree. As Bill says, given that you seem to have bubbles in a restricted area and not broadly dispersed across your board, this seems to indicate an interaction between process materials, rather than a cure or thickness issue.
Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
