Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy
Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Tue Jun 27 16:29:28 EDT 2006 | Board House
There was a good artical on this in Assembly Magazine October 5, 2005 by Donald P. Cullen, Director of OEM and Assembly Applications, MacDermid Inc., Waterbury, CT Heres the Link http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM10000
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Mon Aug 04 12:38:25 EDT 2008 | blnorman
Avoid cardboard boxes as well. They are sulfur bearers, and silver has an affinity to form silver sulfide.
Electronics Forum | Wed Jun 28 22:34:31 EDT 2006 | davef
Yes, it would. That you are asking this question makes us wonder if you would be better advised to contract with a independent FA laboratory to help you baseline your analysis. Among the fine labs to consider are: * Robisan Laboratory 6502 East 21
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
