Electronics Forum: silver palladium leaching (Page 2 of 13)

Palladium silver surface finish

Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard

Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes

RoHS solders and silver termination inks

Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine

we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma

RoHS solders and silver termination inks

Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted

Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h

can silver plating be used as barrier when soldering brass to copper? silver plate the brass?

Electronics Forum | Thu Jun 08 07:56:34 EDT 2017 | jkitt84

In an excellent previous thread davef mentions brass should be plated prior to soldering to prevent zinc leaching from the brass. It is reported once the zinc leaches, the joint is weak. He recommends copper or nickel plating. Would silver plating w

62/36/2Ag solder paste on imersion silver plated PCBs

Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1

Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.

Re: Chip Resistor Failure

Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis

| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr

Re: Chip Resistor Failure

Electronics Forum | Thu Mar 25 02:22:32 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr

Palladium poor wetting

Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine

Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F

| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba


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