Electronics Forum | Mon Mar 21 08:57:29 EST 2005 | davef
Se�or Tech Possibilities are: * The vent on the drain line is blocked. Generally when this happens, the blockage, like come critter building a nest in the pipe, is found on the roof. In this case, the smell would be constant. * Somewhere, the drai
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Oct 21 12:18:22 EDT 2002 | John S
We're looking at a new assembly that will require an SMT heat sink. Can anyone recommend potential vendors for this part? It is new to us, so we're having to start from scratch. Thanks John
Electronics Forum | Sun Aug 01 11:27:40 EDT 2004 | haran
What is the best epoxy attachment method for Heat Sink?The operator always miss the solvent dispensing application prior to epoxy dispense which cause the heatsink falling off at customer site as well as in the factory?Any advise?
Electronics Forum | Tue Mar 01 22:20:59 EST 2005 | davef
Marc: You say, "Copper will sink to the bottom of a pot since it is lighter ..." Why does it sink if it's lighter? What is copper lighter than?
Electronics Forum | Fri Mar 24 14:06:07 EST 2006 | mdemos1
Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern? Thanks, Mike.
Electronics Forum | Fri Mar 19 18:07:24 EDT 2010 | davef
That's how it's supposed to work, but is working correctly on the components that are loosing heat sinks for you? We have two choices: * Poor solderability of either the component or the heat sink ... OR * Wrong solder preform material
Electronics Forum | Tue Jan 06 15:57:30 EST 2004 | dbdavis
Dear Colleagues, I am evaluating the Linear Tech. Corp. LTC1733 MSE Package for use in our SMT Dept.. For this application I will need to consider the possibility that we will be required to repair these devices after some time in the field. My probl
Electronics Forum | Thu Aug 26 21:54:57 EDT 2004 | KEN
I ran into this about 2 years ago. The Rework Operators (all 3 shifts) would rework a device, rince the board with tap water (yep, 50k / Cm^3) from a nearby sink, then send the PCB to test (which is really ironic as they had to walk past the DI wash
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
