Electronics Forum | Thu Sep 30 12:50:09 EDT 1999 | Charlie
I'm looking for information from people using SIPAD in their process. Why did you make the change? Did it reduce the cost of assembely? What advice would you give one considering the change?
Electronics Forum | Thu May 30 07:13:46 EDT 2002 | matherat
Ben, I am not sure about diamond shaped pads but if you are just getting into BGA you need to know about SIPAD ssd. http://www.sipad.com mkehoe
Electronics Forum | Tue Apr 22 05:38:56 EDT 2003 | mk
This sounds like a job for ssd. No pad shapes to worry about. Look into http://www.sipad.net and please contact me off line to discuss it. Matt Kehoe mkehoe@sipad.net
Electronics Forum | Fri Feb 27 07:48:34 EST 2004 | mk
Sorry I am late with the solution but I have been out on the road. Absolutely the reason solid solder deposit was invented. Hands down the best and most affordable, dependable solution to your challenge. http://www.sipad.com mkehoe@sipad.net
Electronics Forum | Tue Apr 13 07:08:34 EDT 2004 | mattkehoe
Dont forget, there is a method for BGA via in pad that is sometimes overlooked. Please look at http://www.sipad.net/sipadvip.htm It works!!!! mkehoe@sipad.net
Electronics Forum | Sun May 02 07:36:47 EDT 2004 | mk
Use solid solder deposit for GGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Sun May 02 07:37:28 EDT 2004 | mk
Use solid solder deposit for BGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Wed Jun 02 06:07:47 EDT 2004 | mattkehoe
Hi Abraham, One solution for BGA cleaning issues may be found in a different way of applying the paste/flux. Look into this link and let us know if you would like to try a sample. http://www.sipad.com/SIPADBGA.htm mkehoe@sipad.net
Electronics Forum | Wed Mar 09 06:38:16 EST 2005 | mattkehoe
Orrrrrrrr, you could try this http://www.sipad.com/SIPADVIP.htm Matt Kehoe mkehoe@sipad.com
Electronics Forum | Tue May 03 15:15:33 EDT 2005 | dphilbrick
The biggest problem is getting paste on the board. We ran a board that had 8 per and would get an occasional insufficient solder joint. I would look into doing the boards with something like a SiPad process (www.sipad.net) My $0.02
