Electronics Forum | Mon Jul 09 20:46:22 EDT 2001 | davef
Is the glue intended for printed SMD attach? 3 Are you following all the manufacturer�s glue shelf life recommendations? 4 Are you observing all the manufacturer�s glue working life guidelines? Finally, what level of skewing are we talking about?
Electronics Forum | Fri Jul 23 08:59:27 EDT 2004 | davef
For reflow, low soak time and low peak temperatures will help reduce the number of components skewing Search the fine SMTnet Archives. For instance: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6071&mc=15
Electronics Forum | Thu Oct 19 15:15:24 EDT 2006 | russ
to use local fids such as this you must use the cad data, when the machine knows where it is supposed to be and seeks there it reads where it (PCB) really is and then corrects the machine, it does not have to be symetrical at all. If you teach fids
Electronics Forum | Fri May 01 14:46:52 EDT 2015 | aprosser
Good afternoon, We are running some aluminum boards through a 7 zone reflow oven which have 2 4 pin right angled headers on the ends that are skewing. Does anyone have any suggestions to prevent this from happening?
Electronics Forum | Thu Aug 01 04:57:10 EDT 2019 | ameenullakhan
hi Team, observed component skew during reflow process. Inductor location. I have attached the image for the same. Please provide your valuable feedback. Attached are the images for the same. Its SAC305 alloy , R0L1 flux chemistry. Regards, Am
Electronics Forum | Thu Aug 01 11:43:57 EDT 2019 | slthomas
I noticed that your solder mask registration is off some. Does it cover a significant portion of any of the pads for these parts? If so, is it possible that the surface tension of the solder at liquidus is enough to skew the part when the solder i
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Sat Jul 01 04:22:09 EDT 2000 | Sal
I have two questions 1. How do I control the skewing of FETs/power regulators ? ( the one's with the big rectangular pad and two smaller one's for the leads).If I go 1:1 with the apertures I seem to get solder balling and when I tryed to minimise th
Electronics Forum | Thu Jun 22 09:33:40 EDT 2000 | Sal
Guys Just completed a PI build. And for the first time found that some chip components are skewing. The board is approximately 8x8inches and is six layer double sided FR4. To minimise and eradicate solder balling all the chip components have been co
Electronics Forum | Fri Jun 23 09:36:58 EDT 2000 | C.K.
Chrys: Funny that you mention that, but here at my company, our oven is blamed on almost everything: skewing, tombstoning, solder shorts, etc.... In fact, we often have to tell the supervisors, "It's not the oven because we don't turn the skewing
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