Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Thu Mar 19 11:44:03 EDT 2020 | svajunasastrauskas
Hello, can someone share good practise how to calculate how many percent solder paste can be applied on solder mask for better solderability (by increasing stencil aperture). In eg, aperture is increased 30 percent, could it be more? Where find this
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Fri Mar 20 09:29:27 EDT 2020 | slthomas
If you just want a little more paste and don't care where it ends up I guess percentage is OK, but if you're trying control where it ends up it makes sense to specify how far, and in which direction(s).
Electronics Forum | Tue Apr 21 21:49:26 EDT 2020 | SMTA-Samy
Why are you trying to overprint? Take some time to review this presentation by Chrys Shea titled SPECIFYING STENCILS TO OPTIMIZE PRINT PERFORMANCE. https://www.smta.org/chapters/files/Uppermidwest_Chrys_Shea_Presentation_Upper_Midwest_Expo.pdf
Electronics Forum | Thu Apr 23 07:34:15 EDT 2020 | stephendo
Stencil editing is something that you have to do to do well. And you have to look at the boards after the screen printer and after the oven. Reading white papers ain't gonna cut it. And then there will always be part pad combos that will introduce s
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Fri May 01 13:23:14 EDT 2020 | stephendo
It could be the paste or the profile. (or something else) You should try changing those one at a time. Also maybe try less paste and using preforms.
Electronics Forum | Thu Mar 19 16:13:28 EDT 2020 | stephendo
I tend to go by extending it by a distance rather than a per centage. For example 10 thou over. Does anyone else give a distance rather than a per centage? For long pads on connectors where I need more solder, a per cent doesn't make sense to me.
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Building A, Jiepeng Square, Fuyong
Shenzhen, China
Phone: 0755-33578694
