Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon
Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege
Electronics Forum | Sun Dec 07 20:51:23 EST 1997 | john martin
part of my job is to id and source electronic components. i have an ongoing problem iding smt devices w/mfr codes in place of actual part numbers does a cross ref guide exist that will enable me to id a smt transistor(eg)by the marking codes on the d
Electronics Forum | Wed Nov 17 15:04:27 EST 2004 | russ
SMT assembly, First, you must utilize paste otherwise the parts will not stay put. Do you have any leaded devices such as QFPs or SOICs? Dispensing paste by hand is very difficult and time consuming for these types of parts. You can either dispense
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Tue Jan 13 10:53:05 EST 1998 | Tonya Warner
It is also my job to ID and cross components. I have found that the same number can be used by different manufacturers for different parts, same package style. There is not a standard marking system for SMT devices so watch out for this.
Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland
Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Aug 19 20:35:02 EDT 2002 | davef
Search the fine SMTnet Archives for sources of converter / conversion interface parts. For instance: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=5315&#Message20714&
Electronics Forum | Wed Jun 15 16:54:33 EDT 2005 | linny999
Siemens is an excellent platform. To reduce your scrap:- Carry out the specified maintenance, especially the segments and valve plungers; Calibrate revolver heads to benchmark. Remove the tables, smooth the magnetic strips, clean the mounting faces,
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