Electronics Forum | Mon Mar 25 10:22:20 EDT 2013 | rgduval
You mentioned that you changed the layout some, and this can be essential in this type of process. If the SMT parts and TH leads have inadequate spacing on the bottom side, shorts may be inevitable (someone else will have to advise what the recommen
Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Wed Jul 14 13:41:40 EDT 2010 | rway
We are running SMT products and have been for some time now. First, I wanted to check with you folks to see what an acceptable FPY rate, or what you would consider and acceptable rate, is. Secondly, we are having issues primarily with product that
Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard
if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.
Electronics Forum | Fri Nov 08 18:36:31 EST 2002 | leeloo
Nowadays I have a problem, I am in chsrge of the section of smt in my company, have a normal process inside my department with a minimal level of mistakes, the problem happens when the material is liberated to the lines of production on happened for
Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF
Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when
Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure
If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c
Electronics Forum | Mon Jul 18 01:47:29 EDT 2005 | Cal
I would suggest 1) Use the profile that is suggested with the BGA types you are using or 2) Have you solder paste rep visit for a half day and help profile your machine. Remember if they want to keep you as a paste customer they will help. Enjoy,
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.
I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te
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