Electronics Forum | Sun Oct 31 09:24:57 EST 2004 | Steve
Consider the availability and the cost of the product. SN/AG/CU is going to be the lead free choice from what I understand. Thus the distributors will be purchasing this formulation in volume thus reducing cost per gram. You get into something that i
Electronics Forum | Wed Jan 05 15:54:51 EST 2005 | Frank R.
Hi, Now in my wave the PCB TOP Side temperature before WAVE is 110 - 115 DegC and the Peak temp in the wave is 240 - 245. These informations are for an 63/37 Alloy. What is the PCB TOP Side temperature and the peak temperature for Lead Free Wave Sn
Electronics Forum | Fri Jul 06 08:10:50 EDT 2018 | davef
ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIES [http://www.jpclech.com/CLECH_SMTAI2005_PAPER.pdf] Jean-Paul Clech EPSI Inc. Montclair, New-Jersey, USA jpclech@aol.com Paper (copyright EPSI Inc. © 2005) was
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Sat Dec 02 11:35:30 EST 2006 | davef
Best dross remover is to not produce dross. Search the fine SMYnet Archives for previous discussions Dross will not increase signicantly * Another story, that lead-free solders will generate a greater volume of dross than conventional materials, is
Electronics Forum | Thu Aug 24 16:59:11 EDT 2000 | Dr. Ning-Cheng Lee
For reflowed solder joints, Bi bearing solder has been reported to exhibit superior fatigue resistance. It also provides better wetting than many other alternatives, including SnAgCu systems. In my opinion, it may be the choice once all Pb can be pha
Electronics Forum | Tue Aug 22 16:22:37 EDT 2000 | Dr. Ning-Cheng Lee
There are certainly many pb-free options being considered by the industry. Currently, the most promising alloys appear to be various combinations of SnAgCu. SnAgBi could also be an option, but to use this alloy, there must be no Pb in the surface f
Electronics Forum | Tue Aug 22 15:34:55 EDT 2000 | Dr. Ning-Cheng Lee
An example of very low melting point Pb-free solder is 58Bi/42Sn. Different versions of this alloys have been tried, such as doping with various additives, in order to enhance the reliability further. Yes, Bi is one element which promises low mp for
Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
