Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly
Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.
Electronics Forum | Fri Nov 18 08:31:09 EST 2005 | jdengler
This is way too long of a time. The SG probably changes significantly over this time. This could be a major contributor to your problems. Jerry
Electronics Forum | Mon Nov 21 06:49:57 EST 2005 | pjc
Go to this link for a nice tool for wave solder process troubleshooting: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5 Look for "Wave Solder Troubleshooting Wizard" If you have an Electrovert machine, contact applica
Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ
No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
