Electronics Forum: solder and wetting and au (Page 2 of 8)

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

assembly serialization and traceability

Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas

What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac

Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak

Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir

Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 11:43:48 EDT 2014 | sara_pcb

It is Solder Mask on Bare copper, The land finish is HASL as per MIL-PRF-55110G which accepts trace of HASL as acceptable. Wetting is acceptable. regards, R.Saravanan


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