Electronics Forum | Mon Jul 16 09:04:00 EDT 2001 | Hussman
No argument here. But I've don't think I've ever seen solder balls on 0402s. Even when they're placed on narrow G dimension pads, where there is little toe fillet, I've never seen a solder ball. But your idea of reversed homeplates would work grea
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 05 07:34:57 EDT 2001 | steven
what is the main reasons that casuing solder ball during reflow? and how to remove them? (mostly arround the connector leads or between the 2 0402 chips). solder paste is RMA type. need advise. thanks
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Thu Jul 05 09:27:05 EDT 2001 | blnorman
Our solder ball problem is linked to moisture. If the paste sits on the board too long (especially during our humid summer months) we experience the problem. As far as the problem being specific to components or areas of the board, maybe some of th
Electronics Forum | Fri Jul 06 04:02:28 EDT 2001 | eliishee
Thanks guys for all the input. i'm still struggling to find out the main cause. at time being, urgently need a suggestion of a effective way to remove all these solder balls. THANKS AGAIN.
Electronics Forum | Wed Jul 18 02:09:50 EDT 2001 | winnifred
Steven, You CANNOT just use water to clean away the solder ball when u hv used RMA paste.
Electronics Forum | Thu May 06 10:05:58 EDT 2004 | leon
iam having trouble with solder balls around 1206 caps and resistors, have used different pastes changed oven profiles can any advise something else
Electronics Forum | Sun May 09 12:59:29 EDT 2004 | Lloydy
Try using the wendy-house style on the specififc area's where you have solder balling. It's not always a good idea to do a global reduction to all apperatures.
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