Electronics Forum | Wed Aug 11 09:51:11 EDT 1999 | Brian
| | | Easy goods-in polymerisation check: clean, white, cotton cloth: wrap it round a suitably gloved finger and pour a few drops of methylene chloride (! toxic) onto the end of the finger and rub it onto the bare board for a minute or so. If it come
Electronics Forum | Thu Aug 12 05:33:23 EDT 1999 | Brian
| | (snip) | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a little later on
Electronics Forum | Thu Aug 12 22:23:23 EDT 1999 | Dave F
| | | | (snip) | | | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a little
Electronics Forum | Fri Aug 13 10:39:25 EDT 1999 | Boca
| | | | | | (snip) | | | | | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a
Electronics Forum | Mon Apr 04 18:19:58 EDT 2005 | halal
Hi! I'm new to here, so let me introduce myself. My name is Szathmari Gabor, and I'm an electrical engineer student in Hungary. There is a task in the university that I have to do, so I ask your help, dear smtnet forumers :) The task is: a factory e
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
