Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Wed Apr 14 08:15:18 EDT 2004 | arcandspark
We have tried other stencils with different size openings but this company will not allow us time or money to run any experiments to define stencil criteria and printer settings, its just run, run, run. They really dont care about post reflow yields.
Electronics Forum | Fri Sep 03 14:20:38 EDT 1999 | David
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | You must have been in the same meeting I was in earlier today. We are currently having some opens on BGAs. The problem joints are all on the perimeter of
Electronics Forum | Thu Oct 05 00:48:22 EDT 2006 | KEN
What is the surface finish of the PCB? What type of BGA? What type of solder / flux are you using?
Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
