JUKI Fast Smart Modular Pick and Place Machine with speed 42000CPH RS-1 Applicable Components: 0402~5050 Board size:50×50??650×370 Feeder inputs:max.112 placement capacity:40,000 CPH Product description: JUKI Fast Smart Modular Pic
JUKI Fast Smart Modular Pick and Place Machine with speed 42000CPH RS-1 Applicable Components: 0402~5050 Board size:50×50??650×370 Feeder inputs:max.112 placement capacity:40,000 CPH Product description: JUKI Fast Smart Modular Pic
New Equipment | Rework & Repair Equipment
We are manufacturer for X-ray inspection machine X-ray counter BGA rework station Contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli Email:sales11@zhuomao.com.cn xbox360 b Product Description Specific
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Industry News | 2012-12-03 16:09:15.0
LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.
Industry News | 2016-11-17 19:00:21.0
KIC today announced that ACI Technologies will host a “Profiling and Solder Reflow: Electronics Manufacturing Skills Training” from Nov. 21-22, 2016. The hands-on training will be conducted on KIC’s automated thermal process tools and systems, and will provide personnel with the knowledge and skills necessary to setup and operate a reflow process. Upon completion students will be able to apply their knowledge of reflow soldering techniques by successfully identifying the heat transfer modes and systems for each reflow method covered.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
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