Electronics Forum | Wed Nov 17 20:11:29 EST 2021 | dwl
is there flux on the board? are you probing a test point or a soldered pad? is the probe hitting the right spot?
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Mon Feb 23 13:25:21 EST 1998 | Steve Gregory
Steve - you must not work to IPC class 2 or 3 requirements. If the solder is "pillowed" around the lead, I would strongly suspect a wetting problem. Most of the Paladium leads I see soldered have a strong line of demarcation but no pillowing. Hav
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
