Electronics Forum | Mon Jul 01 04:50:04 EDT 2019 | sssamw
Yes, No standard.Normally QFN supplier suggest 50-75 um (2-3 mil), but it's very hard to achieve and hard to make consistent stand-off in prodution.
Electronics Forum | Fri Apr 24 14:18:40 EDT 1998 | Scott Davies
I realize this is a SMT forum, but I have another problem related to electronics assembly and hope there will be someone out there that can save my life (this time). We build quite a few VME assemblies to which we attach a SAM board. Fairly standard
Electronics Forum | Mon Apr 27 06:46:39 EDT 1998 | Greg Curler
| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai
Electronics Forum | Wed Jul 12 21:35:56 EDT 2000 | Dave F
John: I agree. We keep out lead stand-off below 60 thou.
Electronics Forum | Mon Jun 01 12:35:44 EDT 1998 | Don Spicer
Contact George Moronus at Electro Prep. 408-739-6015
Electronics Forum | Wed Apr 07 16:59:55 EDT 2004 | russ
I believe that BIVAR makes watersoluble beads /standoffs etc...
Electronics Forum | Mon Jan 16 12:19:55 EST 2006 | russ
Dave, Why does standoff height affect reliability?
Electronics Forum | Thu Mar 28 13:38:35 EDT 2019 | pavel_murtishev
Davef, Thank you for the comprehensive reply. I do really appreciate your help. Regards
Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat
We have seen that vias included in the PCB under the thermal pad will give less voiding.
Electronics Forum | Thu Jul 03 15:03:39 EDT 2003 | Jim Nunns
My design group wants to change our route keep out around all SMT parts to 5 mil even under the parts with zero standoff. Are others in the industry routing under parts that have no standoff? My fear is that we will get shorting if the mask is scaped
