Electronics Forum | Mon Sep 17 10:29:01 EDT 2001 | ksfacinelli
Please describe what was found to be optimal print parameters. I am also interested in hearing about stencil and design layout considerations. Thanks, Kevin
Electronics Forum | Fri Sep 23 03:52:41 EDT 2005 | dougs
Hi, Does anyone know if it's possible to place BGA's with pitch 0.5mm and ball diameter 0.25mm on a siemens F3. the manual says that smallest pitch on BGA's is 0.56mm. Siemens won't commit a yes or no, as you'd expect, but i'd have thought it w
Electronics Forum | Tue Jan 25 17:47:01 EST 2000 | Dennis VanBuren
We are integrating an "Additive Process" on one of our boards - incorporating numerous mod wires, cuts, and new component placements. Some of the new runs pass next to fine pitch devices and will require stencil modifications to accommodate the Addit
Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray
I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason
Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil
Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech
I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until
Electronics Forum | Wed Jan 22 14:14:56 EST 2003 | Stephen
Most of the design considerations will be for the wave soldering of the SMT parts. Have you considered selective soldering pallets or masking as an alternative? One problem I have seen with the epoxy process is parts that are high off the board and t
Electronics Forum | Wed Dec 10 08:41:26 EST 2003 | Craig P. Brown
Dear Mr. Petty: I woould welcome the opportunity of discussing your application requirements in greater detail. Please advise a convenient time that I may personally contact you. Thanking you in advance for your consideration of DEK.
Electronics Forum | Tue Apr 29 11:53:16 EDT 2008 | sliebl
We certainly take that into consideration. You will require additional time to process the board through your shop since as the previous poster mentioned, you need to print, place, and reflow (or cure) twice. Not to mention you will have additional N
