Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp
Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c
Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont
Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se
| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu
5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
