Electronics Forum | Tue Sep 17 15:47:04 EDT 2013 | 18424
Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a
Electronics Forum | Wed Apr 25 14:41:13 EDT 2012 | davef
Try: Equipment, Sldr pallet hdware clips * Summit Precision 5825 S 25th St, Phoenix AZ 85040 Dennis Miller 602-268-3550 summitprecision.com sales@summitprecision.com * Southco 210 N. Brinton Lake Rd, Concordville, PA 19331-0116; 610-459-4000 southco
Electronics Forum | Sat Feb 22 11:37:00 EST 2020 | kylehunter
Hey all, I've made a post in the past about us expanding to a new space, but I wanted to do a new post with specific questions. We currently have a DEK 265, Phillips Opal Xii, and a Heller 1500. Our main reason for expanding is to have a lead-free
Electronics Forum | Thu Apr 05 17:06:11 EDT 2018 | stephendo
We recently got a batch wash machine that can use a chemical cleaner. (not a saponifier). NOW I feel confident cleaning no clean boards. Without a machine that can heat water and use a proper cleaning agent, I would not trust cleaning no clean boards
Electronics Forum | Thu Oct 30 14:26:20 EDT 2008 | davem
80 degrees F in the Summer. Also, "It is not recommended to store foods which must be kept at below 40� F for safe storage". Obviously we're not storing food, but the point is still valid. jdumont, Thanks for the data. I have a couple of Extech di
Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem
Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Thu Jul 20 14:05:59 EDT 2000 | Mike McMonagle
With 0402 components becoming more common today outside of the telecommunications industry, our company is qualifying equipment and processes for an upcoming product incorporating 0402s. Having used 0402s in a previous position, I am planning a DOE o
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