Electronics Forum: surface and mount and techniques (Page 2 of 6)

BGA and PGA

Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef

Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P

tape and reel vendor

Electronics Forum | Wed Mar 10 11:43:11 EST 2004 | Bill Aldeen

My name is Bill Aldeen, and I own and operate Nu-Way Electronics, Inc. We provide Tape & Reel packaging service for surface mount and through-hole electronic components. We're in the Chicago area, and we serve all of North America competitively. W

Headers and SMT

Electronics Forum | Tue Sep 29 11:49:02 EDT 2015 | spoiltforchoice

Typically - hand soldering as you are currently doing. Should your volume justify it you can invest in a selective soldering solution, these might take the form of a robotic arm that essentially replicates manual soldering or a solder jet similar to

Pad and Stencil Design

Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake

The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil

Re: IPC and Nepcon

Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F

| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release

Re: Intelliplace and Europlacer

Electronics Forum | Thu Dec 03 11:01:03 EST 1998 | Walter Cole

Hi Scott, I am a regional manager for Multitroniks and would be glad to assist you with additional information on the systems you are asking about. Both of these machines can be demonstrated for you any time at our factory in Warren, NJ. Below I'l

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Package outlines and footprints

Electronics Forum | Sat Jun 12 16:24:02 EDT 1999 | JohnW

| Is there public domain information available on standard surface mount package outlines and footprints? | Thanks, | WillyW | Willy, The IPC has a great listing for the std packages and footprints, as do most component manufacturers. I'd start on

pick and place adhesive dots

Electronics Forum | Wed Jul 29 12:58:35 EDT 2015 | pankyb1261

Is there anyone that makes a pick and place glue dot for surface mount chip components (B stage epoxy dot in a carrier tape)? Thanks, Rich

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a


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