Electronics Forum | Thu Jan 30 10:42:17 EST 2014 | dominusdrr
Hi. I need to mount a LED SMD type backwards on a PCB. Currently, I am doing that manually. My questions are: Is there a SMD LED with the right package to mount that? The machines automatically place elements on a PCB, Do they could mount the L
Electronics Forum | Wed Feb 10 10:12:35 EST 2016 | vaghelarajeshh
Thanks Mr. Davef, I had tried all possible factors to see good results. BUt I coudln't. 1. Baked Board 2. Board size is small. I used supporting pins so there is less chanches of bowing. 3. I tried to change the profile many times but result is n
Electronics Forum | Mon Jul 31 09:11:56 EDT 2017 | davef
Try: * YUSH Electronic Technology Co.,Ltd [http://www.pcbpunchingmachine.com/product-833.html ] * Asc Electronics & Technology Co., Ltd. [http://www.ddfcc.com/sell-1988453-v-cutting-machine-for-aluminum-board-fr4-singulating-pre-scored-pcba-asc-509
Electronics Forum | Thu Jun 14 21:14:04 EDT 2001 | davef
There�s tons of stuff on-line. Do a net search on "immersion silver". Examples are: * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=571 * http://www.enthone-omi.com/articles/FinalFinishesT1.pdf * http://www.epa.gov/opptintr
Electronics Forum | Thu Aug 26 13:09:08 EDT 1999 | Doug
I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am having
Electronics Forum | Mon Aug 30 16:14:58 EDT 1999 | Dave F
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Fri Feb 11 12:21:44 EST 2000 | Finepitch Services
Doug, What I've done in past was calling them as 1206T.5, 1206T1.0, SOIC16, RESNET16, SOIC16T5.0, ALCAP4, ALCAP5 etc. T means thickness but for the ALCAP case 4 means 4mm diameter. If you have the time and patience, having a board and attaching a s
Electronics Forum | Fri Aug 27 13:34:25 EDT 1999 | Brian Larson
If your through holes are overlarge or the anular rings too small, the surface tension of the wave may exceed that of the joint. I would look at the design. You may want to put a strip of kapton tape on the following edge of the panel to test the "
