Electronics Forum | Wed Apr 11 19:32:39 EDT 2001 | Adam
I'm trying to find information/articles describing the effects of temp and humidity on solder paste. Just recently we have gone through a change outside temperature and humdidty and have notice solderabilty problems with smt boards.
Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef
OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc
Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat
