Electronics Forum: tescon and ict (Page 2 of 7)

No Clean and Underfill

Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron

Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh

Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 16:50:56 EST 2003 | msivigny

Hello Rohan, this is starting to date nearly 6 years ago but I will remember everything I can, we used a custom interface to input data and everything was stored in a very large database on a specific server only for quality data, I think we used Ora

ICT and specifying PCBA testing

Electronics Forum | Wed Mar 24 12:54:02 EDT 2010 | davef

Ignore the defect * Late 1990s to early 2000s => ICT * Early 2000s to mid-2000s => MDA * Mid-2000 on-ward => AOI

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste

ICT and specifying PCBA testing

Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager

When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir

Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave

Via holes and Wave Solder

Electronics Forum | Mon Mar 13 06:11:08 EST 2006 | Rob

Surely this is a job for Wavemaster Larry? Have you tried flux buster pins in your ICT yet? They are quite good at cutting through the crap on a board.

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 30 02:19:17 EDT 2010 | jooh

Regarding X-ray I was referring to ssager's comment "...X-Ray is only as good as the human eye that is operating it...". I thought x-ray images could be checked by software algorithms to find defects, not only human eye?

ICT and specifying PCBA testing

Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway

As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa


tescon and ict searches for Companies, Equipment, Machines, Suppliers & Information

I.C.T ( Dongguan ICT Technology Co., Ltd. )
I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

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I.C.T Industrial Park, Building 1
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Phone: +86 13670124230