Electronics Forum: thermal cycle (Page 2 of 34)

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Mon Jun 24 22:15:56 EDT 2019 | sssamw

Can you please tell us which components cracked? Component type, size, pitch, pin Qty, etc. The solder cracked in thermal cycling is very complicated and difficult to solve.

Thermal cycling

Electronics Forum | Fri Nov 04 10:17:16 EST 2005 | Amol

i though they had a accleration factor as a relationship between ATC and actual life cycles

Sn62Pb36Ag2

Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp

2000 cycles of -40/+150C thermal cycling.

SMT packages that can solder inverted?

Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman

You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed

BGA Thermal Cycling Tests?

Electronics Forum | Wed Nov 19 19:28:59 EST 2003 | bwet

We are looking for recommendations on reliability testing (thermal cycling, vibration, etc.) of BGAs AFTER being soldered to a PCB. Are there any standards that include such things as heating cycles (like a minimum of 5,000 cycles), ball-ball leakag

LF BGA Tests

Electronics Forum | Wed Oct 05 15:03:40 EDT 2005 | Amol

depends on what you want evaluated! you can thermal cycle the BGAs and the examine the x-sections to determine failure modes at different stages of thermal cycles. you can do a stress test and corelate the # of thermal cycles with the microstructu

Gold Surface Finish on PCB's

Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ

We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.

BGA Thermal Cycling Tests?

Electronics Forum | Wed Nov 19 22:39:10 EST 2003 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

Thermal cycling

Electronics Forum | Fri Nov 04 08:29:13 EST 2005 | davef

There is no relationship between accelerated and actual life tests.

Thermal cycling

Electronics Forum | Fri Nov 04 11:07:15 EST 2005 | moonshine

Visit Proof Of Design at http://www.moonmanondarkside.com for free information on this and many other subjects. MoonMan


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