Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
New Equipment | Test Equipment
DGBell’s Temperature and Humidity Test Chamber is able to simulate a wide range of temperature and humidity environment condition for testing various products and components. It is widely used for basic thermal cycling test and accelerated stre
We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.
WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Quick Overview Max 180 x 235mm soldering area Infrared IC Heater T962 is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD、BAG soldering a request on a PCB assembly. The T962
New Equipment | Cleaning Equipment
Fiber optic test need the thermal inducing system temperature cycling system. Because fiber optic test equipment is an important supporting force in the communication industry. It penetrates in communication chip, module, terminal, base station, wire
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
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