Press-fit technology Press-fit technology is that inserting flexible or rigid pins of connectors into plated through holes (PTHs) of printed circuit board (PCB) without soldering. It is reliable and easy to operate. The basic requirement is that th
Briquetting is the transformation of a powdery or granular product into a larger more convenient size. This is accomplished by compacting the product with a roller press sometimes in the presence of a binder material. The briquettes can be produced w
Industry News | 2019-11-05 22:23:45.0
The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.
New Equipment | Solder Materials
Features 1.High frequency current heating ; fast heating and rapid thermal recovery; suitable for lead free soldering. 2.Micro computer control; set temperature only by pressing keys; temperature calibrates digitally; more functions available, suc
New Equipment | Rework & Repair Equipment
High frequency current heating, fast heating and rapid thermal recovery. PLS203G soldering station is suitable for lead free soldering. Micro computer control. Set temperature only by pressing keys and calibrate it digitally. Auto sleeping and auto
Industry Directory | Manufacturer
Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Grey Durostone CAG762 for Reflow Solder Fixture Overview: Durostone composite material CAG762 is made from anti-static optical grey composite material and reinforced fiberglass. The product uses a high performance glass-filler for improved machi
Events Calendar | Tue Jun 05 00:00:00 EDT 2018 - Thu Jun 07 00:00:00 EDT 2018 | Nuremberg, Germany
PCIM Europe 2018 - International Exhibition on Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Permabond structural acrylic adhesives are suitable for bonding a wide variety of materials. The rapid, room-temperature cure coupled with high strength and durability make these adhesives ideal for demanding applications where speed and ease of appl
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