Electronics Forum | Wed Oct 10 02:44:47 EDT 2001 | djarvis
Frank, Don't know about point 1 but if they don't fall off I don't worry about it. If they do fall off it's generally because someone has mishandled them before the wave, like shoving them into racks and the like. If they have fallen off and you can'
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Fri Jul 11 08:17:22 EDT 2008 | aj
Hi Dave, Yes that is correct. I had a XRF carried out on some boards that I am having solderability issues on and the report came back with 0.04um - 0.05um as the measured gold thickness. Previous batches that went through fine measured 0.07-0.11u
Electronics Forum | Thu Oct 02 17:54:46 EDT 2003 | davef
Yes, Russ IPC-6012A w A#1 - Qualification & Performance For Rigid Printed Boards talks to solder mask requirements in 3.8. One interpretation of what it says: * Solder resist [solder mask] must meet the qualification / conformance requirements of S
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Tue Sep 16 10:58:03 EDT 2003 | swagner
I am currently having a discussion with a pcb supplier about inadequate hasl thickness, we are measuring below 40 microinches of hasl when our spec calls for 100 microinches as the minimum. Our supplier came back with the statement the entire indust
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef
Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
